A day dedicated to sharing knowledge, new developments, projects, and solutions to enable sensors to tackle even the most extreme environments: this is the goal of “Advanced Technology Sensors” a free event open to everyone. Now in its second edition, the workshop aims to outline the future of protective packaging for current and next-generation devices.

The highly anticipated IMAPS (International Microelectronics And Packaging Society) workshop will feature some of the most influential voices in the sector, with speakers coming from across Europe to participate in a meeting poised to shape the future of the field. “Only through information sharing, by pooling experience and expertise, we can protect future technologies and provide innovative possibilities for the present,” said Luigi Calligarich, president of the Italian chapter of IMAPS and CEO of Electron Mec.

What is IMAPS?

“It’s an association founded in the United States in the 1990s, aimed at connecting industrial and academic entities (such as university degree programs) involved in microtechnology. The Italian branch took shape in 1998 and quickly became an integral, proactive part of a network of European chapters. IMAPS – Italian Chapter is a non-profit initiative, bringing together around fifty key figures in precision electronics packaging and about ten partner companies. Numerous external organizations, including well-known brands like STM, Nokia, ASE, and Leonardo, have long collaborated with IMAPS and view the association as a reference point in the field.”

What is the association’s objective?

“Primarily, to spread knowledge of packaging technologies among members, companies, and organizations (such as universities), while fostering innovation and encouraging research and development. We typically organize at least two workshops each year and, every ten years, we host a major European event that spans several days, attracting significant participation. The last Italian one in 2019, held in Pisa, drew almost 400 participants. While IMAPS always focuses on protective solutions for electronics and microtechnology, it explores various contemporary fields. For example, on the upcoming 5th, we’ll discuss packaging in sensor technology.”

What does “packaging” mean in this context?

“The term refers to the broader set of technologies aimed at protecting active components. Once the ‘front-end’ production phase of silicon processing is complete (such as in integrated circuits, memory, or AI components), the core of the device is ready, but it still requires suitable protective solutions to be safely installed. For proper functionality, the chip must be assembled and coated to endure anything from mere exposure to air , to extreme temperature fluctuations or mechanical stress. Packaging serves this purpose, and the workshop will explore its outstanding potential with solutions opening doors to exceptional and innovative applications.”

Could you give us some examples?

“Imagine a sensor consisting of micron-sized components, wires, and connections, which must withstand the vibrations of a powerful engine, the harsh conditions of outer space, or temperatures that can shift rapidly from intense heat to extreme cold. Consider the mechanical stresses on an object launched at incredible speeds or the need for millimeter-level precision in movement: all of this requires next-generation, highly reliable sensors. A multimillion-dollar project’s success can depend on factors as small as the chemistry of the adhesives securing the  micro-components, or the assurance of targeted, precise maintenance. This is where devices capable of evaluating the tightness of a single screw, or sensors capable of performing initial data processing at a local level,  limiting data transmission and its reprocessing at a central level come into play: similar innovations can really make a difference, just to give a few examples, in the progress of self-driving vehicles as well as longer-lived satellites”.  

Will this be discussed at the workshop?

“Of course. Among the topics covered,  emphasis will be  on ‘MEMS’ sensors, capable of offering the perfect synthesis between micromechanics and electronics. But not only that: the technological challenges are enormous and the potential that science is preparing is equally unimaginable and exciting. At the meeting we will range from the most recent state of the art on graphene (monoatomic layers that have given life to a material with unique electrical characteristics) to biosensors (sensors compatible with organic tissues of humans or animals). It will be a unique opportunity to understand how much research is investigating at a global level and lay the foundations for common growth”.

Are these innovations only for a select group of experts?

“Quite the opposite. The topics covered are primarily technical, but we wanted to give everyone the chance to participate and deepen their understanding. This is why the introductory presentations by Politecnico staff will be more accessible: Giorgio Ferrari and Alberto Corigliano will discuss general trends in sensor technology, providing an overview also for those outside the field. One of IMAPS’s goals is to maintain a productive dialogue with new generations, so it’s essential for us to continuously engage with universities and inform young people about career opportunities in the European industry.”

To participate in “Advanced Technology Sensors,” an event organized by IMAPS with support from Pack4EU, you can register here.

Interview by Sergio Masini, journalist